| 1 | \documentclass{article} |
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| 2 | \usepackage{fullpage} |
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| 3 | \newcommand{\PSbox}[3]{\mbox{\rule{0in}{#3}\special{psfile=#1}\hspace{#2}}} |
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| 4 | \begin{document} |
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| 5 | \begin{enumerate} |
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| 6 | \item Chemical vapor deposition reactor design |
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| 7 | |
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| 8 | \begin{enumerate} |
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| 9 | \item The streamlines should have looked something like: |
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| 10 | \begin{center} |
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| 11 | \PSbox{cvdcylines.ps}{200pt}{90pt} |
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| 12 | \end{center} |
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| 13 | |
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| 14 | \item The problem given was to make the deposition more uniform from wafer to |
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| 15 | wafer, but not necessarily across each wafer. Based on this, several |
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| 16 | people suggested simply rotating the wafers so the gas would blow across |
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| 17 | them, which would make each wafer the same but would not help uniformity |
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| 18 | across the wafer. Likewise, a couple of people suggested blowing the gas |
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| 19 | faster, which would lead to more uniform concentration from wafer to wafer |
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| 20 | but higher concentration of the depositing gas species in the outflowing |
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| 21 | gas (based on the plug flow equation), though the improved quality could |
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| 22 | well be worth the extra cost. |
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| 23 | |
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| 24 | One design change which would help both inter- and intra-wafer uniformity |
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| 25 | is to lower the temperature, increasing the probability of reaction |
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| 26 | limitation, which would promote very uniform deposition. Unfortunately, it |
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| 27 | would also be very slow. So this illustrates the various cost vs. quality |
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| 28 | tradeoffs which can be made in this type of design problem. |
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| 29 | |
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| 30 | My favorite student answer to this problem was called ``Rotisserie CVD,'' |
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| 31 | which had the wafers hanging on a rotating scaffold to periodically expose |
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| 32 | each to more and less concentrated gas. That might work in principle, |
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| 33 | though having a lot of moving parts in this environment could complicate |
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| 34 | matters... |
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| 35 | \end{enumerate} |
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| 36 | \end{enumerate} |
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| 37 | \end{document} |
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