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Revision 132, 1.2 kB
(checked in by powell, 6 years ago)
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New problem: Chemical vapor deposition reactor design
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Property svn:keywords set to
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| 1 | \documentclass{article} |
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| 2 | \usepackage{fullpage} |
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| 3 | \newcommand{\PSbox}[3]{\mbox{\rule{0in}{#3}\special{psfile=#1}\hspace{#2}}} |
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| 4 | \begin{document} |
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| 5 | \begin{enumerate} |
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| 6 | \item Chemical vapor deposition reactor design |
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| 7 | |
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| 8 | The cylindrical chemical vapor deposition reactor shown below deposits |
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| 9 | a thin film onto multiple hot wafers as one step in microelectronic device |
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| 10 | fabrication. |
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| 11 | \begin{center} |
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| 12 | \PSbox{cvdcyl.ps}{200pt}{90pt} |
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| 13 | \end{center} |
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| 14 | |
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| 15 | \begin{enumerate} |
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| 16 | \item Sketch a cross-section of the reactor, and sketch the streamlines |
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| 17 | describing axisymmetric gas flow through it. |
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| 18 | |
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| 19 | \item Unfortunately, for a long tube reactor such as this, the reactant gases |
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| 20 | can be somewhat depleted by reactions on the first few wafers, so the |
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| 21 | reactant concentration is lower near the later wafers. As a result, the |
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| 22 | deposition rate in the first few wafers is faster than in the last few |
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| 23 | (since it is roughly proportional to the local reactant gas concentration). |
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| 24 | |
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| 25 | Suggest a design change which would solve this problem, resulting in the |
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| 26 | same deposition rate at all of the wafers, and briefly support your design |
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| 27 | change using transport phenomena concepts. |
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| 28 | \end{enumerate} |
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| 29 | \end{enumerate} |
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| 30 | \end{document} |
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